About this scholarly article

Assembly-level reliability: a methodology for effective manufacturing of IC packages by Nguyen, L.T.; Finnell, J.R.; Singh, K.M. is a scholarly article available to read on EtoBox.

Author

Nguyen, L.T.; Finnell, J.R.; Singh, K.M.

Publisher

IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0018-9529)

Published

1995

Language

EN