About this scholarly article

2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference - A Methodology for Improving Granularity of Wafer Strength Testing to Characterize and Qualify a 150 micron DFM Wafer Thinning Process by Dries, Brian; Kingsbury, Jeff; Mohamed, Elias is a scholarly article available to read on EtoBox.

Author

Dries, Brian; Kingsbury, Jeff; Mohamed, Elias

Publisher

IEEE

Published

2008