About this scholarly article

53rd Electronic Components and Technology Conference, 2003. Proceedings. - Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesives by Caers, J.F.J.M.; Zhao, X.J.; Wong, E.H.; Ong, C.K.; Wu, Z.X.; Ranjan, R. is a scholarly article available to read on EtoBox.

Author

Caers, J.F.J.M.; Zhao, X.J.; Wong, E.H.; Ong, C.K.; Wu, Z.X.; Ranjan, R.

Publisher

IEEE

Published

2003

Language

EN