Opening book details…
About this scholarly article
IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) - PPF(pre-plated frame) technology using Sn-Bi and pure Sn electro deposition on alloy 42 lead frame for semiconductor package corresponding to lead-free movement by Kim, J.-D.; Choi, W.-S.; Park, K.-S.; Kim, E.-H.; Lee, S.-B.; Kim, H.-G. is a scholarly article available to read on EtoBox.
- Author
- Kim, J.-D.; Choi, W.-S.; Park, K.-S.; Kim, E.-H.; Lee, S.-B.; Kim, H.-G.
- Publisher
- IEEE
- Published
- 2004
More by Kim, J.-D.; Choi, W.-S.; Park, K.-S.; Kim, E.-H.; Lee, S.-B.; Kim, H.-G.
Browse all works by Kim, J.-D.; Choi, W.-S.; Park, K.-S.; Kim, E.-H.; Lee, S.-B.; Kim, H.-G.