About this Engineering article
Simulating surface tension of Sn-based lead free solder using an artificial neural network by Wu, Min; Su, Xiangyu is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Wu, Min; Su, Xiangyu
- Publisher
- Emerald Group Publishing Limited; Emerald (MCB UP ); Emerald Group Publishing Ltd.; Emerald (ISSN 0954-0911)
- Published
- 2016
- Language
- EN
- Field
- Engineering (Physical Sciences)