About this document

Immersion Cooling for Electronics by jeenurj88 is a document available to read on EtoBox.

The patent describes a multi-fluid, two-phase immersion cooling system for electronic components, which includes a housing that forms a fluid-tight compartment containing a boiling fluid mixture of two dielectric fluids. A condensing fluid, which is immiscible with the boiling fluid and has a lower specific gravity and higher thermal conductivity, is also included to facilitate heat removal. The cooling structure within the compartment features a condensing region in contact with the condensing fluid and a

Author

jeenurj88

Language

EN