About this scholarly article

Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242) - Direct measurement and analysis of the time-dependent evolution of stress in silicon devices and solder interconnections in power assemblies by Jun He, ; Shaw, M.C.; Mather, J.C.; Addison, R.C. is a scholarly article available to read on EtoBox.

Author

Jun He, ; Shaw, M.C.; Mather, J.C.; Addison, R.C.

Publisher

IEEE

Published

1998

Language

EN