About this scholarly article

2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Fast 3D electro-thermal device/circuit simulation based on automated interaction of SDevice and HSpice simulators by Chvala, Ales; Donoval, Daniel; Marek, Juraj; Pribytny, Patrik; Molnar, Marian is a scholarly article available to read on EtoBox.

Author

Chvala, Ales; Donoval, Daniel; Marek, Juraj; Pribytny, Patrik; Molnar, Marian

Publisher

IEEE

Published

2013

Language

EN