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This research investigates the use of a truncated micro-pyramid reflective cavity for enhancing heat dissipation in LED packaging, utilizing silicon micromachining techniques. Thermal simulations indicate that increasing the substrate area can effectively maintain LED operating temperatures below 50°C, which is suitable for commercial applications. The study concludes that while larger cavity sizes may reduce maximum intensity, they improve overall optical performance and heat management for LEDs.

Author

reedshyu

Language

EN