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What is Y-Peel Test for Adhesive Joint Analysis about?

The document describes an objective Y-peel test method for characterizing adhesively bonded carton board. The Y-peel test provides force-elongation curves that can distinguish elastic and inelastic behavior of the adhesive bond. By evaluating the energy dissipated during peeling, the test allows quantitative assessment of bond quality in addition to qualitative results.

Author

ebru

Language

EN