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About this Engineering article
Thinning Technology for Lithium Niobate Wafer by Surface Activated Bonding and Chemical Mechanical Polishing by Wu, Chia-Cheng; Horng, Ray-Hua; Wuu, Dong-Sing; Chen, Tsai-Ning; Ho, Shih-Shian; Ting, Chia-Jen; Tsai, Hung-Yin is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Wu, Chia-Cheng; Horng, Ray-Hua; Wuu, Dong-Sing; Chen, Tsai-Ning; Ho, Shih-Shian; Ting, Chia-Jen; Tsai, Hung-Yin
- Publisher
- Institute of Pure and Applied Physics; Japan Society of Applied Physics; IOP Publishing (ISSN 0021-4922)
- Published
- 2006
- Language
- EN
- Field
- Engineering (Physical Sciences)