Opening book details…
About this Materials Science article
High-Removal Selectivity Through Interaction Between Polyacrylamide and SiO2 Film in Poly Isolation Chemical Mechanical Planarization by Kim, Ye-Hwan; Lee, Kee-June; Park, Jea-Gun; Paik, Ungyu is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Kim, Ye-Hwan; Lee, Kee-June; Park, Jea-Gun; Paik, Ungyu
- Publisher
- American Scientific Publishers (ISSN 1533-4880)
- Published
- 2009
- Language
- EN
- Field
- Materials Science (Physical Sciences)
More by Kim, Ye-Hwan; Lee, Kee-June; Park, Jea-Gun; Paik, Ungyu
Browse all works by Kim, Ye-Hwan; Lee, Kee-June; Park, Jea-Gun; Paik, Ungyu