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About this Engineering article
Enhanced Cooling of Shape Memory Alloy Wires Using Semiconductor "Heat Pump" Modules by Shahin, A. R.; Meckl, P. H.; Jones, J. D.; Thrasher, M. A. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Shahin, A. R.; Meckl, P. H.; Jones, J. D.; Thrasher, M. A.
- Publisher
- SAGE Publications (ISSN 1045-389X)
- Published
- 1994
- Language
- EN
- Field
- Engineering (Physical Sciences)
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