About this scholarly article

1996 IEEE MTT-S International Microwave Symposium Digest - Multichip-on-flex plastic encapsulated MHDI-low cost substrateless manufacturing for microwave and millimeterwave modules by Cooper, P.D.; Piacente, P.A.; Street, R.J. is a scholarly article available to read on EtoBox.

Author

Cooper, P.D.; Piacente, P.A.; Street, R.J.

Publisher

IEEE

Published

1996

Language

EN