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Enhanced electromagnetic wave absorption, thermal conductivity and flame retardancy of BCN@LDH/EP for advanced electronic packing materials by Yongxin Qian; Yubo Luo; You Li; Tianshun Xiong; Luyao Wang; Wenguang Zhang; Shuangfu Gang; Xin Li; Qinghui Jiang; Junyou Yang is a Engineering article available to read on EtoBox.
What is Enhanced electromagnetic wave absorption, thermal conductivity and flame retardancy of BCN@LDH/EP for advanced electronic packing materials about?
The limited functionalization of current electronic packaging materials has restricted their use in advanced smart electronic devices with high energy density and low signal delay. In this study, we propose a novel strategy for developing an electronic packaging material (BCN@LDH/EP) that possesses exceptional electromagnetic wave (EMW) absorption, thermal management, and flame-retardant capabilities. BCN@LDH/EP is the double-level hollow core–shell structure (BCN@LDH) composed of a bowl-shaped carbon nanoshell (BCN) and a layered double hydroxide (NiAl-LDH). This structure offers rich heterogeneous interfaces and high specific surface area, thereby generating abundant polarization sites and favorable impedance matching. Consequently, the epoxy resin (EP) shows outstanding EMW absorption performance, with a maximum effective absorption band (EAB) of 6.43 GHz and a minimum reflection loss (RL) value of −55.75 dB at a filling amount of only 10 wt%. Moreover, the closely packed thermally conductive filler BCN@LDH provides a broad pathway for heat transfer within the EP, resulting in a significant thermal conductivity improvement efficiency (η) of ∼170%. Notably, the high-temperature c
Who reads Enhanced electromagnetic wave absorption, thermal conductivity and flame retardancy of BCN@LDH/EP for advanced electronic packing materials?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Yongxin Qian; Yubo Luo; You Li; Tianshun Xiong; Luyao Wang; Wenguang Zhang; Shuangfu Gang; Xin Li; Qinghui Jiang; Junyou Yang
- Publisher
- Elsevier BV
- Published
- 2023
- Language
- EN
- Field
- Engineering (Physical Sciences)