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Senju M705-GRN360 Lead-Free Solder Paste by Alejandro Hernandez de Dios is a document available to read on EtoBox.

What is Senju M705-GRN360 Lead-Free Solder Paste about?

The document describes a new lead-free solder paste called M705-GRN360-MZ that is designed to address defective fusion problems when mounting BGA/CSP devices. It provides high temperature preheat resistance while maintaining high printability. The paste aims to increase the process margin and prevent defective solder fusion between solder balls and paste. Performance test results show the paste can help fuse solder balls together reliably during reflow even under intentionally difficult mounting conditions.

Author

Alejandro Hernandez de Dios

Language

EN