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BGA and CSP Thermal Cycling Reliability by clearheartboy777 is a document available to read on EtoBox.
What is BGA and CSP Thermal Cycling Reliability about?
The document discusses accelerated thermal cycling test methods used to characterize the reliability of ball grid array (BGA) and chip scale package (CSP) assemblies. It presents failure data for ceramic BGA assemblies under different thermal cycling conditions and compares failure mechanisms and cycles to failure for thermal shock and cycling from -55C to 125C. It also discusses projecting failure rates to other temperature ranges using a modified Coffin-Manson relationship.
- Author
- clearheartboy777
- Language
- EN