About this scholarly article

2005 International Conference On Simulation of Semiconductor Processes and Devices - Applications of Three-Dimensional Topography Simulation in the Design of Interconnect Lines by Sheikholeslami, A.; Parhami, F.; Heinzl, R.; Al-Ani, E.; Heitzinger, C.; Badrieh, F.; Puchner, H.; Grasser, T.; Selberherr, S. is a scholarly article available to read on EtoBox.

Author

Sheikholeslami, A.; Parhami, F.; Heinzl, R.; Al-Ani, E.; Heitzinger, C.; Badrieh, F.; Puchner, H.; Grasser, T.; Selberherr, S.

Publisher

IEEE

Published

2005

Language

EN