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About this Engineering article
Pattern-dependent Microloading and Step Coverage of Silicon Nitride Thin Films Deposited in a Single-wafer Thermal Chemical Vapor Deposition Chamber by J. W. Smith; S. M. Seutter; R. S. Iyer is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- J. W. Smith; S. M. Seutter; R. S. Iyer
- Publisher
- AVS (American Vacuum Society); American Vacuum Society; American Institute of Physics (ISSN 0734-211X)
- Published
- 2005
- Language
- EN
- Field
- Engineering (Physical Sciences)