Opening book details…
About this Engineering article
Foreword Special Issue on System-On-Package (SOP) by Tummala, R.R. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Tummala, R.R.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1521-3323)
- Published
- 2004
- Language
- EN
- Field
- Engineering (Physical Sciences)