About this scholarly article

2016 IEEE CPMT Symposium Japan (ICSJ) - Warpage simulation and experiment for panel level fan-out package by Lin, Tingyu; Hou, Fengze; Liu, Haiyan; Pan, Daicong; Chen, Feng; Li, Jun; Zhang, Hengyun; Cao, Liqiang is a scholarly article available to read on EtoBox.

Author

Lin, Tingyu; Hou, Fengze; Liu, Haiyan; Pan, Daicong; Chen, Feng; Li, Jun; Zhang, Hengyun; Cao, Liqiang

Publisher

IEEE

Published

2016