About this scholarly article

Advances in Electronic Packaging, Parts A, B, and C - A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application by Wong, Shaw Fong; Loh, Wei Keat; Lee, Yung Hsiang; Yap, Eng Hooi; Wong, Siang Woen; Hin, Tze Yang is a scholarly article available to read on EtoBox.

Author

Wong, Shaw Fong; Loh, Wei Keat; Lee, Yung Hsiang; Yap, Eng Hooi; Wong, Siang Woen; Hin, Tze Yang

Publisher

ASMEDC

Published

2005