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About this Engineering article
The novel chamber hardware design to improve the thin film deposition quality in both 12′′ (300mm) and 18′′ (450mm) wafers with the development of 3D full chamber modeling and experimental visual technique by Liao, M.-H.; Chen, C.-H.; Kao, S.-C. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Liao, M.-H.; Chen, C.-H.; Kao, S.-C.
- Publisher
- Elsevier Science; Elsevier ; Elsevier Ltd.; Elsevier BV (ISSN 0017-9310)
- Published
- 2013
- Field
- Engineering (Physical Sciences)