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About this Engineering article
Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation by Fukushima, Takafumi; Iwata, Eiji; Ohara, Yuki; Murugesan, Mariappan; Bea, Jichoel; Lee, Kangwook; Tanaka, Tetsu; Koyanagi, Mitsumasa is a Engineering article available to read on EtoBox.
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- Author
- Fukushima, Takafumi; Iwata, Eiji; Ohara, Yuki; Murugesan, Mariappan; Bea, Jichoel; Lee, Kangwook; Tanaka, Tetsu; Koyanagi, Mitsumasa
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0018-9383)
- Published
- 2012
- Language
- EN
- Field
- Engineering (Physical Sciences)