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About this scholarly article
2012 IEEE 62nd Electronic Components and Technology Conference - Addressing bandwidth challenges in next generation high performance network systems with 3D IC integration by Li, Li; Su, Peng; Xue, Jie; Brillhart, Mark; Lau, John; Tzeng, P. J.; Lee, C. K.; Zhan, C. J.; Dai, M. J.; Chien, H. C.; Wu, S. T. is a scholarly article available to read on EtoBox.
- Author
- Li, Li; Su, Peng; Xue, Jie; Brillhart, Mark; Lau, John; Tzeng, P. J.; Lee, C. K.; Zhan, C. J.; Dai, M. J.; Chien, H. C.; Wu, S. T.
- Publisher
- IEEE
- Published
- 2012
- Language
- EN