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What is Selective Soldering Simulation Study about?
This study utilizes finite element method (FEM) to simulate the selective soldering process of electrical connectors to printed circuit boards (PCBs), addressing the challenges posed by increased component density. The optimal parameters identified for achieving high-quality solder joints include a tin spray moving rate of 3.5 m/s, a preheating temperature of 100°C, and a tin spray temperature of 250°C. The simulation results were validated through experiments, confirming the effectiveness of the FEM model
- Author
- nhittky
- Language
- EN