About this scholarly article

SPIE Proceedings [SPIE International Symposium on Optoelectonics and Microelectronics - Nanjing, China (Wednesday 7 November 2001)] Semiconductor Optoelectronic Device Manufacturing and Applications - Experimental methods for thermomechanical characterization of electronic packages: a review and evaluation by Su, Fei; Yi, Sung; Dai, Fulong; Xie, Huimin; Vora, Mehu; He, Xiaoyuan; Chen, David; Chen, Ray T.; Wang, Guo-Yu; Zhu, Chang-Chang is a scholarly article available to read on EtoBox.

Author

Su, Fei; Yi, Sung; Dai, Fulong; Xie, Huimin; Vora, Mehu; He, Xiaoyuan; Chen, David; Chen, Ray T.; Wang, Guo-Yu; Zhu, Chang-Chang

Publisher

SPIE

Published

2001

Language

EN