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About this Engineering article
Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep by Hasnine, M.; Suhling, J.C.; Prorok, B.C.; Bozack, M.J.; Lall, P. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Hasnine, M.; Suhling, J.C.; Prorok, B.C.; Bozack, M.J.; Lall, P.
- Publisher
- Sage Publications; Springer-Verlag; Springer New York LLC; Springer Science and Business Media LLC (ISSN 0014-4851)
- Published
- 2017
- Language
- EN
- Field
- Engineering (Physical Sciences)
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