About this scholarly article

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Thermomechanical Stress in GaN LED Soldered on Copper Substrate Evaluated by Raman Measurements and Computer Modelling by Signorini, Raffaella; Pedron, Danilo; Conti, Fosca; Hanss, Alexander; Bhogaraju, Sri Krishna; Elger, Gordon is a scholarly article available to read on EtoBox.

Author

Signorini, Raffaella; Pedron, Danilo; Conti, Fosca; Hanss, Alexander; Bhogaraju, Sri Krishna; Elger, Gordon

Publisher

IEEE

Published

2018