About this scholarly article

2006 International Conference on Electronic Materials and Packaging - In-situ Study on the Effects of Temperature and Size on the Electromigration Characteristics of Eutectic SnPb and Pb-free Solder Alloys by Lee, Y. D.; Kim, O. H.; Park, Young-Bae; Yoon, M. S.; Kim, B. N.; Joo, Young-Chang is a scholarly article available to read on EtoBox.

Author

Lee, Y. D.; Kim, O. H.; Park, Young-Bae; Yoon, M. S.; Kim, B. N.; Joo, Young-Chang

Publisher

IEEE

Published

2006

Language

EN