About this Materials Science article
Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling by Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W. is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0925-8388)
- Published
- 2013
- Language
- EN
- Field
- Materials Science (Physical Sciences)