About this scholarly article

2008 31st International Spring Seminar on Electronics Technology - Impact of solder pad shape on lead-free solder joint reliability by Vasko, Cyril; Novotny, Marek; Szendiuch, Ivan is a scholarly article available to read on EtoBox.

Author

Vasko, Cyril; Novotny, Marek; Szendiuch, Ivan

Publisher

IEEE

Published

2008

Language

EN