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This document presents a thermo-visco-elastic shear-lag model to predict residual stresses in photovoltaic modules after lamination. The model uses the Kirchhoff plate theory and shear-lag approach to account for the time- and temperature-dependent properties of the polymeric encapsulant layers. It compares stresses from uniform and non-uniform temperature distributions during cooling after lamination. Non-uniform temperatures lead to lower residual compressive stresses in the silicon cells than uniform tem

Author

lekan4

Language

EN