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What is 3D EBSD Analysis of Co–Ni Grain Structures about?

This study uses three-dimensional electron backscatter diffraction (3D EBSD) to characterize the microstructure of electrodeposited cobalt-nickel films. 2D EBSD previously indicated the development of columnar grains was related to low-energy triple junctions. 3D EBSD allowed verification of this relationship by determining the boundary planes of the triple junctions with high resolution. The triple junctions were found to be formed by boundaries of different character, including a coherent twin boundary. T

Author

welbertncp

Language

EN