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About this Engineering article
Thermal Fatigue and Creep Fracture Behaviors of a Nanocomposite Solder in Microelectronic/Optoelectronic Packaging by Zhang, X.P.; Lim, C.S.H.; Mai, Yiu Wing; Shi, Yao Wu is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Zhang, X.P.; Lim, C.S.H.; Mai, Yiu Wing; Shi, Yao Wu
- Publisher
- Trans Tech Publications, Ltd.; Trans Tech Publications Ltd. (ISSN 1662-9795)
- Published
- 2006
- Field
- Engineering (Physical Sciences)
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