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The document summarizes different thin film deposition techniques including LPCVD, PECVD, thermal oxidation, and electrodeposition. LPCVD provides the most uniform and highest quality films but requires vacuum and higher temperatures. PECVD can be done at lower temperatures but results in lower quality films. Thermal oxidation provides the best quality films but consumes some of the substrate. Electrodeposition is a versatile process but some metals cannot be deposited. Reactive walls in CVD reactors are he

Author

Yifan Wang

Language

EN