About this scholarly article

2017 IEEE International Conference on Computer Design (ICCD) - Cross-Layer Resilience in Low-Voltage Digital Systems: Key Insights by Cheng, Eric; Abraham, Jacob; Bose, Pradip; Buyuktosunoglu, Alper; Campbell, Keith; Chen, Deming; Cher, Cheng-Yong; Cho, Hyungmin; Le, Binh; Lilja, Klas; Mirkhani, Shahrzad; Skadron, Kevin; Stan, Mircea; Szafaryn, Lukasz; Vezyrtzis, Christos; Mitra, Subhasish is a scholarly article available to read on EtoBox.

Author

Cheng, Eric; Abraham, Jacob; Bose, Pradip; Buyuktosunoglu, Alper; Campbell, Keith; Chen, Deming; Cher, Cheng-Yong; Cho, Hyungmin; Le, Binh; Lilja, Klas; Mirkhani, Shahrzad; Skadron, Kevin; Stan, Mircea; Szafaryn, Lukasz; Vezyrtzis, Christos; Mitra, Subhasish

Publisher

IEEE

Published

2017