About this scholarly article

2006 IEEE Workship on Signal Propagation on Interconnects - Analysis and Design of Electromagnetic Bandgap (EBG) Structures for Power Plane Isolation Using 2D Dispersion Diagrams and Scalability by Engin, A.; Toyota, Yoshitaka; Kim, Tae; Swaminathan, Madhavan is a scholarly article available to read on EtoBox.

Author

Engin, A.; Toyota, Yoshitaka; Kim, Tae; Swaminathan, Madhavan

Publisher

IEEE

Published

2006

Language

EN