About this scholarly article

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Wafer-level TSV connectivity test using ring oscillator scheme by Pak, Jun So; Cho, Jonghyun; Kim, Joohee; Kim, Heegon; Kim, Kiyeong; Kim, Joungho; Lee, Junho; Park, Kunwoo is a scholarly article available to read on EtoBox.

Author

Pak, Jun So; Cho, Jonghyun; Kim, Joohee; Kim, Heegon; Kim, Kiyeong; Kim, Joungho; Lee, Junho; Park, Kunwoo

Publisher

IEEE

Published

2012