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Smoothing of single crystal diamond by high-speed three-dimensional dynamic friction polishing: Optimization and surface bonds evolution mechanism by Yuting Zheng; Aude E.L. Cumont; Mingjie Bai; Yifan Liang; Jinlong Liu; Junjun Wei; Xiaotong Zhang; Haitao Ye; Chengming Li is a Engineering article available to read on EtoBox.
What is Smoothing of single crystal diamond by high-speed three-dimensional dynamic friction polishing: Optimization and surface bonds evolution mechanism about?
The high-speed three-dimensional movement dynamic friction polishing (3DM-DFP) has been recognized as an efficient approach for ultra-smoothing single crystal diamond (SCD) surface. Continuing from the previous works focusing on the subsurface cleavage of diamond after 3DM-DFP, process optimization and surface reaction evolution mechanism as a fundamental building block is investigated, for the first time, for comprehensively understanding this fast-smoothing manner. By systematically adjusting the controlling factor, stronger load (0.3 MPa) and appropriate duration (0.5 h) as well as moderate sliding speed (in the range of 30 to 45 m s -1 ) is found to be able to obtain the smooth surface of SCD without uncontacted traces or break-surface cleavage. Subtle residual clues on SCD surface as a function of progressive DFP procedure indicate that Fe catalytic oxidation mainly produce Fe 2 O 3 and partial intermediate oxides Fe 1-y O. Meanwhile, the activated oxygen inserts sp 3 C-C bonds could form C-O or C --O and C-O-V (vacancy) at existing reactive surface sites. The (100) favorable C --O bonds can be rebuilt if (100) surface is reformed, although the C -O bonds associated with non-(
Who reads Smoothing of single crystal diamond by high-speed three-dimensional dynamic friction polishing: Optimization and surface bonds evolution mechanism?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Yuting Zheng; Aude E.L. Cumont; Mingjie Bai; Yifan Liang; Jinlong Liu; Junjun Wei; Xiaotong Zhang; Haitao Ye; Chengming Li
- Publisher
- Elsevier BV
- Published
- 2021
- Language
- EN
- Field
- Engineering (Physical Sciences)