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About this Engineering article
Improved uniformity of Ni/Au coating on circuits by electroless plating by Liu, Dongguang; Tian, Heng; Lin, Lijing; Shi, Wenchao is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Liu, Dongguang; Tian, Heng; Lin, Lijing; Shi, Wenchao
- Publisher
- Institute of Materials, Minerals and Mining; Maney Publishing; Informa UK Limited (ISSN 0267-0844)
- Published
- 2018
- Language
- EN
- Field
- Engineering (Physical Sciences)
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