Opening book details…
About this Engineering article
Thermally induced IC package cracking by Suhl, D. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Suhl, D.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0148-6411)
- Published
- 1990
- Field
- Engineering (Physical Sciences)