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About this Materials Science article
Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection by Wang, Junqiang; Wang, Qian; Liu, Ziyu; Wu, Zijian; Cai, Jian; Wang, Dejun is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Wang, Junqiang; Wang, Qian; Liu, Ziyu; Wu, Zijian; Cai, Jian; Wang, Dejun
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0169-4332)
- Published
- 2016
- Field
- Materials Science (Physical Sciences)
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