About this scholarly article

2008 10th Electronics Packaging Technology Conference - Package Design Optimization for Electrical Performance of a Power Module using Finite Element Analysis by Erwin, Ian V. Almagro; Paek, Seung-Han; Lee, Taek-Keun is a scholarly article available to read on EtoBox.

Author

Erwin, Ian V. Almagro; Paek, Seung-Han; Lee, Taek-Keun

Publisher

IEEE

Published

2008

Language

EN