About this scholarly article

Volume 1: Thermal Management - Benchmarking Study on the Thermal Management Landscape for 3D ICs: From Back-Side to Volumetric Heat Removal by Brunschwiler, Thomas; Sridhar, Arvind; Ong, Chin Lee; Schlottig, Gerd is a scholarly article available to read on EtoBox.

Author

Brunschwiler, Thomas; Sridhar, Arvind; Ong, Chin Lee; Schlottig, Gerd

Publisher

American Society of Mechanical Engineers

Published

2015

Language

EN