About this document
CAF: Risks in PCB Miniaturization by asamadh is a document available to read on EtoBox.
The document discusses conductive anodic filament (CAF) formation in printed circuit boards, which occurs when a copper filament forms between two conductors under an electrical bias. CAF can cause electrical failures and threatens continued miniaturization of electronics. Key factors that influence CAF include applied voltage, humidity, temperature, feature size, glass weave orientation, and surface ionic impurities. The author describes tests on sample boards to analyze the effect of these various factors
- Author
- asamadh
- Language
- EN