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About this Engineering article
Adhesive Wafer Bonding with Ultra-thin Intermediate Polymer Layers by Bleiker, S.J.; Dubois, V.; Schröder, S.; Stemme, G.; Niklaus, F. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Bleiker, S.J.; Dubois, V.; Schröder, S.; Stemme, G.; Niklaus, F.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0924-4247)
- Published
- 2017
- Field
- Engineering (Physical Sciences)