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About this Engineering article
Examination of the Adaptability of the Copper Electroplating Method of Stress Analysis to the Low Temperature Range by SEIKA, Masaichiro; HOSONO, Kikuo; UNO, Soji is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- SEIKA, Masaichiro; HOSONO, Kikuo; UNO, Soji
- Publisher
- The Japan Society of Mechanical Engineers; Japan Society of Mechanical Engineers (ISSN 0029-0270)
- Published
- 1973
- Field
- Engineering (Physical Sciences)
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