About this scholarly article

2017 IEEE International Interconnect Technology Conference (IITC) - RDL layout pattern reliability analysis and optimization with TCAD stress modeling by Wang, Tzu Chen; Yeh, Chih Chieh; Xu, Xiaopeng; Sayed, Karim El; Lin, Chun-Hung Steven is a scholarly article available to read on EtoBox.

Author

Wang, Tzu Chen; Yeh, Chih Chieh; Xu, Xiaopeng; Sayed, Karim El; Lin, Chun-Hung Steven

Publisher

IEEE

Published

2017

Language

EN