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About this Engineering article
A Computational Study on Slurry Flow Between a Wafer and Pad in CMP (Cases without Groove, with Circular Grooves and Radial Grooves) by NAGAYAMA, Katsuya; KIMURA, Keiichi; MORISHITA, Hirofumi; TANAKA, Kazuhiro is a Engineering article available to read on EtoBox.
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- Author
- NAGAYAMA, Katsuya; KIMURA, Keiichi; MORISHITA, Hirofumi; TANAKA, Kazuhiro
- Publisher
- The Japan Society of Mechanical Engineers; Japan Society of Mechanical Engineers/Nihon Kikai Gakkai; Japan Society of Mechanical Engineers (ISSN 0387-5016)
- Published
- 2007
- Field
- Engineering (Physical Sciences)
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